bilboda Posted August 3, 2015 Author Report Posted August 3, 2015 The B+ solder pad is lifting on one end. but still connected. Can I secure it with superglue?
bilboda Posted August 3, 2015 Author Report Posted August 3, 2015 All signs point to hot glue. The wire is soldered to the pad. the pad is still connected. Limited hot glue to secure it during assembly should be the ticket.
John Posted August 5, 2015 Report Posted August 5, 2015 I'd use a high temperature hot melt (they make ones specifically for electronics which are awesome, but for a one off hobby build nobody will kick you out of electronics heaven for craft store hot melt) or epoxy. Epoxy has a somewhat higher max working temperature than cyanoacrylate, and is more shock resistant. But in a pinch, CA is a lot better than just letting the pad tear off.
techbearus Posted August 11, 2015 Report Posted August 11, 2015 Sad to say.. my GND pad is also lifting. My mod is a 3d print and this is the negative lead from 510 and the only ground to board, all other are on plastic no screws. Is this safe to use for now until I get some hot melt glue as mentioned by John.
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